TLMI Corporation, located in Austin, TX, is a trusted and reliable full-service wafer bumping partner, specializing in end-to-end, turnkey wafer flip chip fabrication services. With a focus on prototype development, initial production ramps, and specialty bumping of flip chip interconnect applications, TLMI delivers the highest customer satisfaction and utilizes advanced technology to meet the most demanding engineering requirements.
Offering a range of services including solder bumping, gold bumping, copper bumping, indium bumping, pad redistribution, and mask layout, TLMI's advanced plating technology ensures consistent and stable production capabilities. With expertise in fine pitch bumping and tall copper bumping, TLMI provides innovative solutions for wafer bumping needs.
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