Priority Packaging, Inc. is a leading provider of integrated circuit expertise, specializing in semiconductor IC prototype assembly, IC repackaging, and wafer saw services. With a commitment to quality, timeliness, and cost-effectiveness, they offer a wide range of services including IC prototyping, BGA reball rework, module assembly, and laser etching. Their comprehensive menu of services caters to the needs of customers in design debug, test program evaluation, and IC failure analysis.
With a focus on precision and efficiency, Priority Packaging, Inc. utilizes advanced equipment and techniques such as cross-sectioning, stacked-die assembly, and high magnification resolution. Their expertise in die recovery, IC bonding, and hybrid laminate-ceramic assembly sets them apart in the industry. As a trusted partner, they provide customers with the connectivity required for seamless design processes and comprehensive testing, ensuring optimal performance and reliability of integrated circuits.
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