Micross Advanced Interconnect Technology LLC is a leading provider of advanced interconnect solutions based in Durham, NC. They offer a wide range of products and services including die wafer solutions, component modification, and global field support. With their expertise in advanced packaging and integration technologies, Micross serves various industries such as aerospace, defense, and telecommunications.
With state-of-the-art facilities and a highly skilled management team, Micross is committed to delivering high-quality and reliable solutions to their customers. They are known for their expertise in 2.5 3D heterogeneous integration, system-in-package (SiP) solutions, and wafer bumping. Additionally, Micross offers a comprehensive range of component design and packaging services, ensuring that their customers' specific needs are met. Through their dedication to innovation and customer satisfaction, Micross continues to be a trusted partner in the field of advanced interconnect technology.
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