Kelvin Thermal Technologies Inc, based in Lafayette, CO, is a leading innovator in the field of thermal management and system integration of microelectronic devices. Founded in 2014 by renowned experts in the field, the company has developed a portfolio of Intellectual Property (IP) related to ultra thin and highly effective Thermal Ground Planes (TGP), also known as vapor chambers or 2-D flat heat pipes. With a strong focus on research and development, Kelvin Thermal Technologies is poised to revolutionize the industry with their cutting-edge TGP products.
Under the leadership of their President and CEO, Y.C. Lee, and with the expertise of their Director of R&D, Ryan J. Lewis, the company has made significant advancements in manufacturing processes and business activities. Their dedication to innovation has resulted in the upcoming mass production of their first TGP product by January 2021, in collaboration with their manufacturing partners. With a team of distinguished technology leaders and a strong foundation of academic research, Kelvin Thermal Technologies is at the forefront of thermal management solutions for the ever-evolving world of microelectronics.
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