Okamoto Corporation's Semiconductor Equipment Division is a leading provider of precision systems for the processing and handling of various materials in the semiconductor industry. With a wide range of backgrinders, polishers, slicers, and lapping machines, Okamoto offers solutions for materials such as Silicon, GaAs, Sapphire, Quartz, and many others, catering to diverse customer needs. Their tools are also suitable for different wafer types and processes, including SOI wafers, bonded wafers, bumped wafers, TSV, and MEMS processes.
Committed to the health and safety of their customers and employees, Okamoto Corporation continues to offer support and services during the COVID-19 pandemic. With their extensive experience and dedication to customer satisfaction, Okamoto Corporation remains a trusted partner in the semiconductor industry.
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