Broadpak Corporation, based in San Jose, CA, is a leading provider of innovative total solutions for 2.5D and 3D products, specializing in advanced semiconductor technology and custom integrated circuit design. The company has a strong presence in the industry, regularly presenting at major conferences worldwide to showcase their cutting-edge advancements in 3D integration technologies.
With a focus on scalability and co-design methodologies, Broadpak continues to drive advancements in heterogeneous integration tools and manufacturing infrastructure. Their expertise in silicon interposer design and chiplet integration positions them as a key player in the development of next-generation technologies for applications such as AI, AR/VR, and autonomous driving.
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