American Precision Dicing is a leading wafer dicing service based in San Jose, CA, specializing in precision mechanical dicing of various hard brittle materials such as silicon, glass, ceramics, and more. With over 20 years of experience, they cater to a wide range of customers including universities, research labs, start-ups, and production operations, offering fast turn-around times for small to medium-sized jobs.
Their advanced wafer dicing process capabilities allow them to make cuts as thin as 20 microns wide, process wafers as thin as 50 microns, and cut a wide range of wafer sizes up to 300 mm in diameter. They also provide custom trench profiles, dicing before grind (DBG) processing, and offer various packaging options for shipping. With a strong focus on customer satisfaction, American Precision Dicing ensures high-quality dicing services and efficient project management from start to finish.
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